Chip Quik Smooth Flow Low Temp Solder Paste Sn42/Bi57/Ag1 T4 10g Syringe
Product ID: 517028775
🔥Low melting point 137°C
🧪Halogen-free synthetic no-clean flux
⚖️86.75% metal content
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⚡ Solder smarter, not harder — flow like a pro with Chip Quik Smooth Flow!
Chip Quik Smooth Flow Low Temp Solder Paste (Sn42/Bi57/Ag1) is a lead-free, halogen-free, no-clean solder paste featuring advanced Smooth Flow™ technology for superior spread and shear. With a low melting point of 137°C and 86.75% metal content, it protects delicate components while delivering reliable, high-quality solder joints. Its long refrigerated shelf life and easy cleanup make it a top choice for both professionals and hobbyists aiming for precision and efficiency.
| Manufacturer | Chip Quik® |
| Part Number | NC191LTA10 |
| Package Dimensions | 9.9 x 5.8 x 1.7 cm; 10 g |
| Item model number | NC191LTA10 |
| Material | metal |
| Batteries included? | No |
| Batteries Required? | No |
| Item Weight | 10 g |
C**N
Excellent product, Recommend for Beginners and Professionals Alike
This Solder Paste whilst may seem a bit expensive is a really good product and worth the money in my opinion. It's easy to use and makes working on small circuit boards a breeze, whether you are placing new components on a fresh PCB, reflowing, removing components or resoldering it is great. Working at lower temperatures means less chance of damaging the components, pads etc. It is definitely one of the best I've used so far it seems to go along way, has a good amount of flux in the mix and cleaning was easy afterwards.
Y**V
Nice and useful all-round soldering paste
I prefer this soldering paste because 1. Much easier to get out of the syringe, does not require heavy pushing as with MG Chemicals one 2. Melts instantly, and goes into place thanks to the decent amount and quality of flux 3. Lead-free
H**Y
Prototype Thermal Paste
Easy to work with, low melting point. Comes with reflow profile.
V**R
Works well as low temp solder
First time using solder paste after 25+ years. Nice that it shipped with two nozzles. I did manual soldering. Needed to remember to release extra paste till see liquidish substance coming out. Spread the paste on pads, not too thick. Do not worry if it touches adjacent pads. Pressed ADXL345 LGA chip onto the pads. Used 150 deg C heat gun. The paste solder melted in a few seconds and chip just sat there. Very nice result. Never using solder for chips with funky pads. Good product.
J**N
Super
Una gran ayuda
J**.
Works to remove heat sensitive components from circuit boards.
This is an excellent way to remove electronic components from heat sensitive circuit boards. You can achieve solder melt at temperatures around 300 degrees F. Just apply over top of the leads on lead or lead free solder and using a hot air rework machine bring the area up to around 300 degrees F. The solder paste will blend with the solder on the board and allow you to remove the component without excessive heat. Always re-tin the pads the original solder and wick off to remove any residue of the bismuth from the removal.
A**G
Wish I knew about this stuff sooner.
Works great. Mush easier then traditional soldering. Works with a lighter or soldering iron. Magic stuff.
G**G
Easy flow, breaks
For an extremely gentle solder that absolute no tension will be involved…this is great. But it has broken its solder joints 8/10 times for me.
Trustpilot
3 weeks ago
1 week ago